Polyamide n-gun dat ni

Polyamide adhesive gaw TH-9150 hte TH-9180 a hpang e nga ai madung hpaji masa rai nga ai, grau nna ra kadawn ai mawdaw hte electronics ni hpe shinggyin la lu ai mayak mahkak ni a matu engineering galaw da ai, n-gun ja ai hot-melt formulasi lahkawng re. TH-9150 gaw 150℃hta n-gun yawm mat nna , TH-9180 gaw 180℃du hkra nbung n-gun hpe jat ya lu ai ; grade lahkawng yan hpe uniform black pellets hku nna jaw ya ai rai nna, n-gun n law ai ntsin de lawan ai hku lwi mat wa ai, rai tim, lawan ai hku galaw lu na matu hte kadun ai cycle aten ni a matu kalang ta hpraw ai n-gun hpe shalat ya lu ai. Dai resin ni gaw 100 % solids, RoHS/REACH hte maren rai nna VOCs n shapraw ai daram rai nna, galaw shapraw ai ni hpe san seng ai, bungli galaw masha ni a matu htuk manu ai solvent (sh) reactive chemistries ni a malai kaga ladat langai jaw ya ai.

Mawdaw kata kaw, polyamide adhesive dinghku gaw, dashboard, chyinghka card, bawnu shingnip hte dung shara shingnip ni hta lang ai n bung ai substrate ni a lapran, n-gun rawng ai, n-gun rawng ai matut mahkai lam ni hpe shabyin ya ai. Dai gaw PP, ABS, PC, PA, SMC, aluminum ni hpe grai n-gun n dat ai sha, hka ja nna, –40℃kaw nna, nta kata na nbung katsi ai hta grau tsaw ai du hkra, n-gun hpe n-gun jaw ya ai. TH-9180 hpe grau nna engine-nbung n-gun grau san seng ai nta ni, powertrain shingnip ni, sensor bracket ni a matu masat da ai-dai shara hta aten galu 150℃nbung, ATF, mawdaw sau hte lam ntsa na sau ni hpe jahten kau na re. Shi a hka hpe n hkap la ai shingdu gaw hka hpe n hkap la ai majaw, 1000 h SAE J2196 hka kata de bang ai chyam dinglik ai lam ni galaw ngut ai hpang, matut mahkai n-gun hte dimensional stability gaw n galai shai ai sha nga ai.

Beyond the car body, the same polyamide adhesive chemistry functions as a low-pressure molding compound for electronic encapsulation. 180–220℃du hkra katsi nna 3–15 bar hta bang dat ai shaloi, TH-9150 hte TH-9180 gaw n-gun kya ai PCB ni, n-gun n rawng ai n-gun rawng ai shara ni, matut mahkai ai lam ni hte n-gun rawng ai sensor ni a grup yin hta shim lum ai hku lwi hkawm nna, second loi mi laman hta n-gun ja wa nna she8}8 byin pru wa ai. Dai kaw na pru wa ai encapsulant gaw 20 kV mm−1 dielectric n-gun, –40℃kaw nna 150℃du hkra nbung n-gun hpe hkam sharang lu ai, 30 % galu kaba wa ai majaw n-gun n rawng ai sha jak rung n-gun hpe hkam sharang lu ai. Dai majaw, Harness galaw ai ni gaw, lahkam law law na epoxy potting (sh) over-molding a matu, langai lang sha galai shai ai hku nna hkap la nna, bungli galaw ai manu hpe shayawm ya ai sha n-ga, bungli galaw ai lam hpe mung lawan ladan galaw ya ai.

Grade lahkawng yan hpe hka n-gun n rawng ai, 25 kg htinggaw ni hta bang nna, n-gun n rawng ai hka htung ni (sh) n-gun n law ai hka htung ni de hkrak sha bang mai ai. Nta kata na nbung katsi ai shara hta tawn da ai gaw, n yawm htum lahkawng ning tup bungli galaw lu ai atsam hpe makawp maga ya nna, katsi ai-chain jai gumhpraw hpe yeng seng kau ya ai. TH-9150 hte TH-9180 polyamide re adhesive system ni gaw mawdaw hte electronic OEM ni hpe grau galu kaba wa hkra galaw ya ai.

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