Hka lum ai n-gun kaba ai Polyamide katsi ai hka lum ai n-gun dat a myit masa

Hpa majaw nga yang, n-gun ja ai polyamide n-gun ja ai-hpyen n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai n-gun rawng ai. Shi gaw 140–150℃lapran na hka n-gun rawng nna, madung hku nna shan n-gup hpe shinggrup ai, katsi ai hku shinggrup ai, n-gun rawng ai zawn re ai hkyepdin galaw ai lam ni hta jai lang ai. Shi hpe hkyen lajang ai hta, dimer linoleic acid, sebacic acid, ethylenediamine, hte hexamethylenediamine ni hpe n-gun dat hku jai lang nna, nitrogen makawp maga ai npu hta, n-gun ja ai-n-gun ja ai n-gun dat hku nna polyamide resin hpe shapraw ai lam lawm ai. Dai ladat hta, n-gun shayawm ai, n-gun shayawm ai, amine manu hpe chyam dinglik ai lam ni lawm ai.

Ndai adhesive a softening point hpe raw material ratio hpe galai shai ai hku nna galai shai mai ai majaw, 140–200℃lapran na nbung katsi ai shara hta galaw na matu htuk manu ai. 1-phenyl-3-pyrazole zawn re ai pyrazole hpe 1% daram n-gun ja hkra galaw na matu, 260℃hta pyi ngang grin ai hku galaw lu ai.